Facing the new era's development needs and domestic and international situations, resolutely carrying out high-tech weaponry work with unique Chinese characteristics is the only way to achieve better and faster development of our country's weaponry. Components, as the industrial foundation, are an important area for the implementation of national defense strategies. It can be said that if components are advanced, the country's heavy equipment will be advanced; if components are autonomous and controllable, the national equipment will be autonomous and controllable. Core technologies cannot be bought. The continuous innovation of core technologies relies on continuous efforts under autonomous and controllable conditions, to ensure comprehensive fundamental technological innovation from the source to the main development, and to truly achieve autonomy and controllability.
In order to promote the development of the special electronic components industry and timely grasp the latest situation and requirements of civilian participation in the military, and more effectively achieve the goal of joining the military, under the supervision and guidance of the National Defense Science and Technology Industry Administration, the China Association for the Peaceful Use of Military Technology, the All-China Federation of Industry and Commerce Science and Technology Equipment Industry Chamber of Commerce, the Beijing Military-Civilian Integration Collaborative Innovation Association, Guizhou Aerospace Electric Appliance Co., Ltd., and Beijing Enterprise Development Exhibition Service Co., Ltd. have decided to jointly organize the "5th China (Beijing) Special Electronic Components Exhibition 2025" with relevant enterprises and institutions from six major industries in the military industry (nuclear, aviation, aerospace, shipbuilding, ordnance, and electronics). The exhibition will be held from June 12 to 14, 2025, at the China International Exhibition Center, Chaoyang Hall, Beijing. The Beijing Special Electronic Components Exhibition is a high-quality platform for centralized procurement and exchange among major military industry groups in China, and has become synonymous with supply and demand meetings in the defense and military industry. The Beijing Special Electronic Components Exhibition is recognized by the demand side as a national-level supply and demand docking platform with a comprehensive range of exhibitors for military electronic components.
Scope of exhibits:
Military electronic components: electronic components, filters, relays, semiconductor discrete devices, light sensing devices, embedded systems, vacuum devices, optoelectronic devices, communication devices, electroacoustic devices, frequency devices, time-frequency devices, Beidou devices, piezoelectric crystals, quartz crystals, military power supplies, switches, connectors, high-speed cables, PCBs, sensitive components, medium and high-frequency components, sensors, micro-special motors, general electromechanical components, thermal conduction and heat dissipation components, packaging and testing, electronic materials, chassis and shell processing, hardware products and parts, etc;
Semiconductor and integrated circuits: integrated circuit design, integrated chips, chip processing, packaging and testing, specialized semiconductor equipment and materials, integrated circuit products (processors, memories, sensors, silicon devices, power electronic devices, semiconductor devices, diodes and triodes, quantum devices, embedded products, PMICs, etc.), third-generation semiconductor devices and materials, intelligent power products, packaging materials, packaging shells, chassis, cabinets, etc;
Military printed circuit boards: various types of panels, including single-sided, double-sided, and multilayer circuit boards, as well as printed boards, multilayer boards, flexible boards, microwave boards, high-frequency boards, substrates, multilayer microstrip boards, and other high-precision, high-density circuit boards, flexible boards, and circuit boards; various chassis and shell processing, PCBA and finished product assembly, electronic assembly equipment, materials (SMT), etc;
Military microwave and radio frequency: radio frequency/microwave/millimeter-wave components, microwave passive devices, microwave active devices, antenna feeder components, radio frequency devices, complete communication microwave systems, microwave materials, testing and measurement, EAD simulation, antenna design, cable components, connectors, chips and packaging, specialized software, metal housing processing, etc;
Military precision ceramics: ceramic components, MLCC, LTCC, HTCC, ceramic raw materials, precision ceramics, structural ceramics, high-temperature ceramics, ceramic microspheres, ceramic bearings, semiconductor ceramics, ceramic substrates, DPC, DBC, AMB, HTCC substrates, LTCC substrates, alumina, aluminum nitride, silicon nitride, beryllium oxide powder and substrates, ceramic assemblies, ceramic products, ceramic materials, ceramic packaging shells, etc;
Military electronic materials: new electronic materials and products, metal electronic materials, semiconductor packaging materials, electronic tin solder, welding materials, piezoelectric and ferroelectric materials, electronic functional materials, ceramic materials, insulating materials, heat shrinkable materials, magnetic materials, shielding materials, heat dissipation and thermal conductivity materials, thermal interface materials, conductive materials, phase change materials, chemical raw materials, thermally conductive polymers, specialty plastics, adhesives, films/tapes, sealants, etc;
Military test and measurement: electronic and communication instruments, RF and microwave instruments, oscilloscopes, signal generators, signal analysis, signal acquisition, spectrum analysis, electronic loads, AC/DC power supplies, environmental test instruments and equipment, mechanical test equipment, data recording and acquisition, anti-static equipment, analytical instruments, instruments and meters, etc;
Electronic production equipment: SMT surface mount technology, wire harness processing and connector manufacturing, system-level packaging, electronic manufacturing automation, dispensing and glue injection, soldering, EMS electronic manufacturing, testing and measurement, PCB manufacturing, semiconductor equipment, component manufacturing, laser equipment, printing and labeling, assembly tools, shell processing, precision machining, precision grinding, deburring, precision cleaning, surface treatment, vacuum coating, precision parts, etc.
